CNLA & IECQ

www.cnla.org.tw、 www.iecq.org

ETAC / Kusumoto

www.etac.kusumoto.co.jp

SIR13：PCB, CSP/FC/BGA Package, Special Material IM/IR Measurement System（Current also）.

MLR22：BGA/CSP/Flip Chip Solder Ball & Low R Reliability Test System.

ED70S：SMT Material/Process Reliability Test System                               【Fully meet IPC9701 & EIAJ7407 STD】

TCI50/MCL41/TLE60：MLCC, Chip C/R/L Reliability Test System.

EM/TDDB/HCI：IC Reliability Test System.

Network Linking ”Chamber & Tester” Integrated Monitoring System.

Envirotronics

www.envirotronics.com

Custom Chamber：AGREE, HASS/HALT, ESS, Dust

Everbeing

www.envirotronics.com

Probe Station, Laser Cutter Consumables

Four Points Probe - For Surface Resistance Measurement system

Hot Chuck

ICT

www.ICT-probe.com

Probe Card Consumables

Korima/TNP

www.korima.com、www.tnpinstruments.com

Laser Glass Cutter (CO₂ Laser)

Aging Chamber

EMMI - Front / Back Side

NSC

www.nscnet.co.jp

PS102W/PS102S：Sulfuric, Nitric IC Decap Machine.

ES301/371/401：R.I.E./Plasma Etching System （Both IC/Wafer）

FB101/102：IC Curve Tracer, IC Open/Short, Dynamic IDDQ Test System.

FA201：FA ATE Tester （Curve Tracer / Dynamic IDDQ / Function）.

BA101: PC control IC/Wafer Front/Backside Lapping Machine (resolution : 1um)

NewWave

www.new-wave.com

EzLaze

QuickLaze

QFI

www.quantumfocus.com

FA Microscopy : emmi / XIVA / LISM / Hot Spot Multi Sensor machine

Infrared Scope II : Infrared Micro Thermal Mapping

UltraTec

www.ultratecusa.com

ASAP-1/ARC-lite：Backside EMMI/FIB Sample Preparation Tools 【Mechanical Decap】

Ultrapol , Multipol : Cross Section Sample Lapping Machine

TTM

Contact Pin for IC Auto Handler